"I love ASM AMICRA"

2022-05-09 00:53:35

Home Company Core Strengths History Management Horst Lapsien Rudolf Kaiser Dr. Johann Weinhändler Applications SiPhotonics/PIC 3D IC/TSV/TCB Active Optical Cable (AOC) FanOut Products Die- & Flip Chip Bonder CoS Die Bonder: High-precision chip-on-substrate bonding AFC Plus - Die Bonder and Flip Chip Bonder Nova Plus - Die Bonder and Flip Chip Bonder NANO - Die Bonder and Flip Chip Bonder High Speed Dispense Systems Dispense System Contact News Jobs Login ASM AMICRA Microtechnologies GmbHASM AMICRA Microtechnologies is a worldwide leading supplier of ultra high precision Die Attach Equipment specializing in submicron placement accuracy (±0.2µm@3s). Our equipment offering supports:Die Attach and Flip Chip Bonding High Speed Dispense System and Custom Solutions Our market focus includes: Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP, Automotive Sensors/LiDAR. For more information, please contact our professional team of experienced engineers worldwide here. Best in class fully automatic wafer ink systems Highest accuracy micro assembly solutions Highest flexibility for customization Upcoming Trade Shows ECTC 2022San Diego, CA, USAMay 30 - June 3Booth 606CIOE 2022Shenzhen, ChinaSeptember 07-09Booth: tbdECOC 2022Basel, SwitzerlandSeptember 19-21Booth: 658 News ASM AMICRA gets Top 100 seal 2022 ASM AMICRA has been awarded the TOP 100 seal 2022, in the 29th round of the prestigious TOP 100 innovation… Panel-Level Heterogeneous Integration Technology for Analog ICs An article featuring ASM AMICRA's NOVA+ MTP System and X-Celeprint's MTP technology can be found in the Semiconductor Digest’s August/September… 20 years anniversary of ASM AMICRA featured in an article on Die Wirtschaftszeitung ASM AMICRA is being featured in an article on Die Wirtschaftszeitung, on May 28th, 2021, p. 13. Die Wirtschaftszeitung is… ASM AMICRA Unveils Industry’s First Manufacturing Systems Incorporating X-Celeprint’s MTP Technology for High Volume Heterogeneous Integration of Ultra-Thin Chips Proven MTP technology enables massively-parallel pick-and-place of large arrays of ultra-thin chips, bringing new heterogeneous integration capabilities for 3D ICs… Read more... LINKEDINFACEBOOKYOUTUBE +49 941 208209 0ask our experts ImprintPrivacyTerms and conditions This websites is using cookies.I agree.More Information.