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[node_name] => [node_type_id] => Forum [parent_node_id] => 1 [display_order] => 1 [display_in_list] => 1 [lft] => 2 [rgt] => 3 [depth] => 1 [style_id] => 0 [effective_style_id] => 0 [breadcrumb_data] => {"1":{"node_id":1,"title":"Main Category","depth":0,"lft":1,"node_name":null,"node_type_id":"Category","display_in_list":true}} [navigation_id] => [effective_navigation_id] => ) [_relations:protected] => Array ( ) [_previousValues:protected] => Array ( ) [_options:protected] => Array ( ) [_deleted:protected] => [_readOnly:protected] => [_writePending:protected] => [_writeRunning:protected] => [_errors:protected] => Array ( ) [_whenSaveable:protected] => Array ( ) [_cascadeSave:protected] => Array ( ) [_behaviors:protected] => ) ) [_previousValues:protected] => Array ( ) [_options:protected] => Array ( ) [_deleted:protected] => [_readOnly:protected] => [_writePending:protected] => [_writeRunning:protected] => [_errors:protected] => Array ( ) [_whenSaveable:protected] => Array ( ) [_cascadeSave:protected] => Array ( ) [_behaviors:protected] => ) ) [_previousValues:protected] => Array ( ) [_options:protected] => Array ( ) [_deleted:protected] => [_readOnly:protected] => [_writePending:protected] => [_writeRunning:protected] => [_errors:protected] => Array ( ) [_whenSaveable:protected] => Array ( ) [_cascadeSave:protected] => Array ( ) [_behaviors:protected] => ) ) [populated:protected] => 1)Recent Forum ThreadsTechInsights teardown of Exynos 990 reveals scary Samsung 7nm BEOLlatest reply by DaRAGingLunatic on May 25, 2022started by Fred Chen on May 25, 2022Intel CEO Pat Gelsinger: The U.S. needs more geographically balanced supply chainslatest reply by Portland on May 24, 2022started by hist78 on May 23, 2022Top Three Suppliers Held 94% of 2021 DRAM Marketsharelatest reply by Fred Chen on May 24, 2022started by Daniel Nenni on May 24, 2022Broadcom is buying VMwarelatest reply by hist78 on May 24, 2022started by hist78 on May 23, 2022New Heat Dissipation Method to Greatly Improve Performancelatest reply by fansink on May 23, 2022started by Arthur Hanson on May 23, 2022TSMC 4nm vs Samsung 4nmlatest reply by mgoldsmith1979 on May 23, 2022started by prime007 on May 20, 2022Do "chip design" and "tape out" costs on older nodes reduce over time?started by Xebec on May 23, 2022Silicon-28 nanowires articlelatest reply by U235 on May 23, 2022started by jms_embedded on May 22, 2022Will Intel’s Turnaround Plan Include Ankle Bracelets?latest reply by coldsolder215 on May 23, 2022started by fansink on May 18, 2022Shanghai Ship Blockadelatest reply by Daniel Nenni on May 23, 2022started by Daniel Nenni on May 19, 2022Recent Article CommentsIntel to present Intel 4 process at the VLSI Technology SymposiumI believe Intel 4 is 13 EUV layers and Intel 3 will be 15 EUV layers. 3 is just denser… — Scotten Jones on May 24, 2022Intel to present Intel 4 process at the VLSI Technology SymposiumFrom what I heard Intel 4nm is doing 12 EUV layers but Intel 3nm will do twice that many? And… — Daniel Nenni on May 23, 2022Intel to present Intel 4 process at the VLSI Technology SymposiumIntel 4 is roughly the same density a TSMC 4nm but significantly less dense than TSMC 3nm. Intel 4 is… — Scotten Jones on May 23, 2022Intel to present Intel 4 process at the VLSI Technology SymposiumThese are good numbers for Intel 4, coming to market 1 year after Samsung and TSMC, with higher density (pending… — benb on May 21, 2022TSMC N3 will be a Record Setting Node!The key is 3nm is a lot more difficult and risky. Most customers (other than Samsung in house Exynos )… — VCT on May 20, 2022TSMC N3 will be a Record Setting Node!My eye is definitely focused on Ambarella. They've used Samsung from the very start and have been very pro-Samsung Foundry… — prime007 on May 19, 2022TSMC N3 will be a Record Setting Node!Thank you, Daniel TSMC may be the only "viable" supplier of 3nm, through 2024, possibly approaching 2025. — isofilm on May 19, 2022TSMC N3 will be a Record Setting Node!Talk about getting your ass kicked. — nickw on May 19, 2022.chpcs_title {z-index:1 !important;display:visible !important;}.chpcs_foo_content img {max-width: 800px;}.chpcs_image_carousel .chpcs_prev, .chpcs_image_carousel .chpcs_next{background: rgba(168, 32, 32, 0);color: rgb(0, 0, 0);font-size: 32px;line-height: 32+7px;width: 32+10px;height: 32+10px;margin-top: -32px;}.chpcs_image_carousel.chpcs_prev:hover, .chpcs_image_carousel .chpcs_next:hover {color: rgb(170, 170, 170);}#wa_chpcs_pager a {background: rgb(170, 170, 170);}TSMC N3 will be a Record Setting Node!With the TSMC Technical Symposium coming next month…Read MoreWebinar – 112 Gbps PAM4 Implementation with Real-World Case StudiesAre 112G PAM4 channels in one of your…Read MoreWhy Traceability Now? Blame Custom SoC DemandIn the SoC world, we can’t believe our…Read More224G Serial Links are NextThe tremendous increase in global data traffic over…Read MoreCybersecurity Threat Detection and MitigationEvery week in the technology trade press I…Read More‹›Semiconductor Expert ForumPosted on May 24, 2022May 24, 20223D IC Update from User2User3D IC Update from User2Userby Daniel Payne on 05-24-2022 at 10:00 amView Profile View Forum Posts View ArticlesPrivate Message Categories: EDA, Siemens EDAOur smart phones, tablets, laptops and desktops are the most common consumer products with advanced 2.5D and 3D IC packaging techniques. I love seeing the product tear down articles to learn how advanced packaging techniques are being used, so at the User2User conference in Santa Clara I attended a presentation from Tarek Ramadan,… Read More Posted on May 24, 2022May 23, 2022Sensing – Who needs it?Sensing – Who needs it?by Dave Bursky on 05-24-2022 at 6:00 amView Profile View Forum Posts View ArticlesPrivate Message Categories: Analog Bits, Events, IPIn a simple answer – everyone.  A keynote presentation “Sensing the Unknowns and Managing Power” by Mahesh Tirupattur, the Executive Vice President at Analog Bits at the recent Siemens User2User conference, discussed the need and application of sensors in computing and power applications. Why sense? As Mahesh explains, sensing… Read More Posted on May 23, 2022May 23, 2022Unlocking PA design with predictive DPDUnlocking PA design with predictive DPDby Don Dingee on 05-23-2022 at 10:00 amView Profile View Forum Posts View ArticlesPrivate Message Categories: EDA, Keysight EDANext up in this series on modulated signals is an example of multi-dimensional EM design challenges: RF power amplifiers (PAs). Digital pre-distortion (DPD) is a favorite technique for linearizing PA performance. Static effects are easy to model and correct, but PAs are notorious for interrelated dynamic effects spoiling … Read More Posted on May 23, 2022May 20, 2022Protecting High-Speed Interfaces in Data Centers with Security IPProtecting High-Speed Interfaces in Data Centers with Security IPby Kalar Rajendiran on 05-23-2022 at 6:00 amView Profile View Forum Posts View ArticlesPrivate Message Categories: Events, IP, SynopsysThe never ending appetite for higher bandwidths, faster data interfaces and lower latencies are bringing about changes in how data is processed at data centers. The expansion of cloud to the network edge has introduced broad use of artificial intelligence (AI) techniques for extracting meaning from data. Cloud supercomputing… Read More Posted on May 22, 2022May 23, 2022Double Diffraction in EUV Masks: Seeing Through The Illusion of SymmetryDouble Diffraction in EUV Masks: Seeing Through The Illusion of Symmetryby Fred Chen on 05-22-2022 at 7:00 amView Profile View Forum Posts View ArticlesPrivate Message Categories: Events, LithographyAt this year’s SPIE Advanced Lithography conference, changes to EUV masks were particularly highlighted, as a better understanding of their behavior is becoming clear. It’s now confirmed that a seemingly symmetric EUV mask absorber pattern does not produce a symmetric image at the wafer, as a conventional DUV … Read More Posted on May 22, 2022May 23, 2022Take a Leap of Certainty at DAC 2022Take a Leap of Certainty at DAC 2022by Daniel Nenni on 05-22-2022 at 6:00 amView Profile View Forum Posts View ArticlesPrivate Message Categories: Ansys, Inc., EDA, EventsThe live events I have attended thus far this year have been very good. As much as I liked the virtual events, attending in the comfort of my home or sailboat, it is great to be live and networking inside the semiconductor ecosystem, absolutely.Ansys has been a great supporter of the Design Automation Conference but this year they … Read More Posted on May 21, 2022May 20, 2022Radiodays Europe: Emotional KeynoteRadiodays Europe: Emotional Keynoteby Roger C. Lanctot on 05-21-2022 at 6:00 amView Profile View Forum Posts View ArticlesPrivate Message Categories: AutomotiveOne doesn’t expect to get emotional at the kickoff keynote for an industry event, but Radiodays Europe 22 flipped the script with live music and a bulletin from Ukrainian broadcasters beamed in from a bunker in Ukraine. The bunker broadcast followed speeches from Swedish and Finnish broadcasting executives including … Read More Podcast EP81: The Future of Neural Processing with Quadric’s Steve RoddyPodcast EP81: The Future of Neural Processing with Quadric’s Steve Roddyby Daniel Nenni on 05-20-2022 at 10:00 amView Profile View Forum Posts View ArticlesPrivate Message Dan is joined by Steve Roddy, chief marketing officer of Quadric, a leading processor technology intellectual property (IP) licensor. Roddy brings more than 30 years of marketing and product management expertise across the machine learning (ML), neural network processor (NPU), microprocessor, digital signal processor … Read More Posted on May 20, 2022May 19, 2022Intel to present Intel 4 process at the VLSI Technology SymposiumIntel to present Intel 4 process at the VLSI Technology Symposiumby Scotten Jones on 05-20-2022 at 8:00 amView Profile View Forum Posts View ArticlesPrivate Message Categories: Events4 CommentsThe VLSI Symposium on Technology & Circuits will be held in Hawaii from June 12th to June 17th. You can register for the conference here.The tip sheet for the conference has been released and one thing that caught my eye is some data from the Intel 4 paper that Intel will be presenting at the conference.Intel’s old roadmap had 14nm,… Read More Posted on May 20, 2022May 20, 2022CEO Interview: Vaysh Kewada of Salience LabsCEO Interview: Vaysh Kewada of Salience Labsby Daniel Nenni on 05-20-2022 at 6:00 amView Profile View Forum Posts View ArticlesPrivate Message Categories: AI, CEO InterviewsVaysh Kewada is cofounder and CEO at Salience Labs, a company developing an ultra high-speed multi-chip processor that packages a photonics chip together with standard electronics to enable exascale AI. Salience is funded by Oxford Sciences Enterprise, Cambridge Innovation Capital, Arm-backed Deeptech Labs, former Dialog… Read More Posts navigationPage 1Page 2…Page 830Next page .rpwe-block ul { list-style: none !important; margin-left: 0 !important; padding-left: 0 !important; } .rpwe-block li { border-bottom: 1px solid #eee; margin-bottom: 10px; padding-bottom: 10px; list-style-type: none; } .rpwe-block a { display: inline !important; text-decoration: none; } .rpwe-block h3 { background: none !important; clear: none; margin-bottom: 0 !important; margin-top: 0 !important; font-weight: 400; font-size: 12px !important; line-height: 1.5em; } .rpwe-thumb { border: 1px solid #EEE !important; box-shadow: none !important; margin: 2px 10px 2px 0; padding: 3px !important; } .rpwe-summary { font-size: 12px; } .rpwe-time { color: #bbb; font-size: 11px; } .rpwe-comment { color: #bbb; font-size: 11px; padding-left: 5px; } .rpwe-alignleft { display: inline; float: left; } .rpwe-alignright { display: inline; float: right; } .rpwe-aligncenter { display: block; margin-left: auto; margin-right: auto; } .rpwe-clearfix:before, .rpwe-clearfix:after { content: ""; display: table !important; } .rpwe-clearfix:after { clear: both; } .rpwe-clearfix { zoom: 1; } Trending NowMay 25, 2022Webinar – 112 Gbps PAM4 Implementation with Real-World Case StudiesWhy Traceability Now? 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[node_name] => [node_type_id] => Forum [parent_node_id] => 1 [display_order] => 1 [display_in_list] => 1 [lft] => 2 [rgt] => 3 [depth] => 1 [style_id] => 0 [effective_style_id] => 0 [breadcrumb_data] => {"1":{"node_id":1,"title":"Main Category","depth":0,"lft":1,"node_name":null,"node_type_id":"Category","display_in_list":true}} [navigation_id] => [effective_navigation_id] => ) [_relations:protected] => Array ( ) [_previousValues:protected] => Array ( ) [_options:protected] => Array ( ) [_deleted:protected] => [_readOnly:protected] => [_writePending:protected] => [_writeRunning:protected] => [_errors:protected] => Array ( ) [_whenSaveable:protected] => Array ( ) [_cascadeSave:protected] => Array ( ) [_behaviors:protected] => ) ) [_previousValues:protected] => Array ( ) [_options:protected] => Array ( ) [_deleted:protected] => [_readOnly:protected] => [_writePending:protected] => [_writeRunning:protected] => [_errors:protected] => Array ( ) [_whenSaveable:protected] => Array ( ) [_cascadeSave:protected] => Array ( ) [_behaviors:protected] => ) ) [_previousValues:protected] => Array ( ) [_options:protected] => Array ( ) [_deleted:protected] => [_readOnly:protected] => [_writePending:protected] => [_writeRunning:protected] => [_errors:protected] => Array ( ) [_whenSaveable:protected] => Array ( ) [_cascadeSave:protected] => Array ( ) [_behaviors:protected] => ) ) [populated:protected] => 1)Recent Forum ThreadsTechInsights teardown of Exynos 990 reveals scary Samsung 7nm BEOLlatest reply by DaRAGingLunatic on May 25, 2022started by Fred Chen on May 25, 2022Intel CEO Pat Gelsinger: The U.S. needs more geographically balanced supply chainslatest reply by Portland on May 24, 2022started by hist78 on May 23, 2022Top Three Suppliers Held 94% of 2021 DRAM Marketsharelatest reply by Fred Chen on May 24, 2022started by Daniel Nenni on May 24, 2022Broadcom is buying VMwarelatest reply by hist78 on May 24, 2022started by hist78 on May 23, 2022New Heat Dissipation Method to Greatly Improve Performancelatest reply by fansink on May 23, 2022started by Arthur Hanson on May 23, 2022TSMC 4nm vs Samsung 4nmlatest reply by mgoldsmith1979 on May 23, 2022started by prime007 on May 20, 2022Do "chip design" and "tape out" costs on older nodes reduce over time?started by Xebec on May 23, 2022Silicon-28 nanowires articlelatest reply by U235 on May 23, 2022started by jms_embedded on May 22, 2022Will Intel’s Turnaround Plan Include Ankle Bracelets?latest reply by coldsolder215 on May 23, 2022started by fansink on May 18, 2022Shanghai Ship Blockadelatest reply by Daniel Nenni on May 23, 2022started by Daniel Nenni on May 19, 2022Recent Article CommentsIntel to present Intel 4 process at the VLSI Technology SymposiumI believe Intel 4 is 13 EUV layers and Intel 3 will be 15 EUV layers. 3 is just denser… — Scotten Jones on May 24, 2022Intel to present Intel 4 process at the VLSI Technology SymposiumFrom what I heard Intel 4nm is doing 12 EUV layers but Intel 3nm will do twice that many? And… — Daniel Nenni on May 23, 2022Intel to present Intel 4 process at the VLSI Technology SymposiumIntel 4 is roughly the same density a TSMC 4nm but significantly less dense than TSMC 3nm. Intel 4 is… — Scotten Jones on May 23, 2022Intel to present Intel 4 process at the VLSI Technology SymposiumThese are good numbers for Intel 4, coming to market 1 year after Samsung and TSMC, with higher density (pending… — benb on May 21, 2022TSMC N3 will be a Record Setting Node!The key is 3nm is a lot more difficult and risky. Most customers (other than Samsung in house Exynos )… — VCT on May 20, 2022TSMC N3 will be a Record Setting Node!My eye is definitely focused on Ambarella. They've used Samsung from the very start and have been very pro-Samsung Foundry… — prime007 on May 19, 2022TSMC N3 will be a Record Setting Node!Thank you, Daniel TSMC may be the only "viable" supplier of 3nm, through 2024, possibly approaching 2025. — isofilm on May 19, 2022TSMC N3 will be a Record Setting Node!Talk about getting your ass kicked. — nickw on May 19, 2022Copyright © 2022 SemiWiki.com. All rights reserved.Legal / Sponsor Disclosure - About SemiWiki#search-2 .widgettitle { display: none !important; }#media_image-7 .widgettitle { display: none !important; }#media_image-13 .widgettitle { display: none !important; }#media_image-14 .widgettitle { display: none !important; }#media_image-4 .widgettitle { display: none !important; }#media_image-2 .widgettitle { display: none !important; }#media_image-12 .widgettitle { display: none !important; }